TECHNOLOGY TRANSFER
Technology transfer is the process by which knowledge acquired by an entity while developing a particular technology is transferred to external entity including public and private sector, academia, State and Central Government organization, etc.
NSIL and IN-SPACe have been mandated to transfer the technologies developed by DOS/ISRO centres/units so that benefits of the space programme are transferred to Indian Industries thereby contributing towards technological self-reliance, industrial growth and national development.
Department of Space has authorised NSIL to enter into Technology Transfer Agreement with suitable entrepreneurs/ Industry in India.
The Technology Transfer Process is given here below:
I) Submission of Technology Transfer (TT) Request through IN-SPACe portal. Link is given below:
II) Evaluation of company profile and technical capabilities by IN-SPACe
III) Signing of TT Agreement with NSIL & IN-SPACe
IV) Remittance of TT Fee to NSIL
V) Handholding for technology transfer by ISRO
Thefollowing technologies are available for transfer to Industries.
| S No. | Technology Name |
|---|---|
| 1 | Antennas |
| 1.1. | C band Active Radar Calibrator |
| 1.2 | Compact L5 Band Ceramic Antenna |
| 1.3 | Design Of Ku/C/L and S Band Cassegrain Feed |
| 1.4 | Design of 6 port Ku-band Tx/Rx LP Monopulse feed for TT&C Operations |
| 1.5 | Dual feed Square patch antenna for Broadcast receiver |
| 1.6 | Dual feed Square Patch antenna for Reporting Terminal |
| 1.7 | Dual Polarized, S&X Band Mono Pulse Feed for Tracking LEO Satellites |
| 1.8 | Ground Peneration Radar (GPR) |
| 1.9 | Ka Band 5W Solid State Power Amplifier |
| 1.10 | L-Band True Time Delay Phase Shifter |
| 1.11 | Multilayer Printed Antenna Technology |
| 1.12 | Patch Array Antenna for Portable Multimedia Terminal |
| 1.13 | S/X/Ka Tri-Band Feed |
| 1.14 | X band Wide scan Active Phased Array Antenna |
| 2 | Communication & Navigation |
| 2.1 | Advanced High Data Rate Modulator |
| 2.2 | Design & Development of FPGA based Digital Demodulator |
| 2.3 | Distress Alert Transmitter (DAT-SG) |
| 2.4 | Low Cost Multi Standard Satellite Receiver (Data DTH) Technology |
| 2.5 | Low Noise Amplifiers (LNAs) and RF Amplifiers for GNSS & VHF bands |
| 2.6 | Mobile Satellite Services Terminal - Broadcost Receiver |
| 2.7 | Mobile Satellite Services Terminal - Portable Multimedia terminal |
| 2.8 | Mobile Satellite Services Terminal - Reporting Terminal |
| 2.9 | Mobile Satellite Services Terminal - Satellite Mobile Radio |
| 2.10 | Navl Based RTK System and comprising sub-system of : (UHF Radio, RTK processing Software , High Gain Rover Active Antenna) |
| 2.11 | Navic Messaging and Positioning Receiver |
| 2.12 | Personnel Tracker |
| 2.13 | Pseudo lite Based Navigation System |
| 2.14 | Radiosonde |
| 2.15 | Rapidly Deployable Multi-band VSAT Terminal for Disaster Management |
| 2.16 | Two Way MSS Terminal for Vessel Tracking |
| 2.17 | Two Way s-band data (MSS) Terminal |
| 2.18 | Two-Channel Digital Monopulse Tracking Receiver for Earth Station |
| 2.19 | V Band Low Noise Amplifier |
| 3 | RF & Electronics |
| 3.1 | Burst Demodulator IP Core |
| 3.2 | Battery Charge Regulator (BCR) |
| 3.3 | Battery Discharge Regulator |
| 3.4 | Ceramic Servo Accelerometer (CSA) |
| 3.5 | CV-CC solar array simulator for 420/70V BUS |
| 3.6 | c/Ku Ortho Mode Transducer for combined c/Ku Receive Feed Systems Ferrite based Wave |
| 3.7 | Differential Pressure Transducer (DPT) |
| 3.8 | DVD-RCS to DVB S2 Onboard Processing Payload |
| 3.9 | Electronic Safety Handheld Ohmmeter (ESHO) |
| 3.10 | E-plane Filter |
| 3.11 | Eddy Current Damper |
| 3.12 | Electronic Safety Handheld Ohmmeter (ESHO 4.5) |
| 3.13 | Evanescent Mode Filters |
| 3.14 | Fine line PCB Technology for Fine-pitch surface Mount Devices |
| 3.15 | Ferrite based Wave guide Circulators and Isolators |
| 3.16 | Guide Circulators and Isolators |
| 3.17 | Gold Plated PTH/ Non PTH PCBs |
| 3.18 | Ground Penetrating Radar |
| 3.19 | Highly Accelerated Thermal Shock (HATS) System for Assessment of PCB via Reliability |
| 3.20 | High Power Circulator-Switch Assembly |
| 3.21 | Highly Accelerated Thermal Shock (HATS) System for Assessment of PCB via Reliability |
| 3.22 | HMC 30W DC-DC Converter |
| 3.23 | HMC DC-DC Converters (30W) |
| 3.24 | IDLV Pressure Transducer |
| 3.25 | MEMS based Pressure Transducer |
| 3.26 | Microwave Data Analysis Software (MIDAS) |
| 3.27 | MEMS Acoustic Sensor |
| 3.28 | Miniaturised High Frequency DC DC Converter |
| 3.29 | PTS-84 Temperature Sensor |
| 3.30 | Piezo-Electric Vibration Sensor (PEVS) |
| 3.31 | Portable Bathymetry profiler System |
| 3.32 | Rigid-flex Multilayer PCB Technology |
| 3.33 | RF Design of Ku-band 6-port Tx-Rx Monopulse Feed System |
| 3.34 | Ribbon Stack Heat Flux Sensor |
| 3.35 | SCPC Modem IP Core |
| 3.36 | Supercapacitors |
| 3.37 | Solid State Recorder |
| 3.38 | TCP-84 Temperature Sensor |
| 3.39 | TRISP (Triple Input Smart Power Supply) |
| 3.40 | Thermal Sensors and Heat Flux Sensor |
| 3.41 | Ultrasonic Burning Rate Measurement System (UBRMS) |
| 3.42 | Ultrasonic Liquid Level sensor (USLS) |
| 3.43 | 15W C Band Solid State Power Amplifier |
| 3.44 | 21 NA Pressure Transducer |
| 4 | Remote Sensing |
| 4.1 | Algorithm for detecting Mineral-Limestone |
| 4.2 | Cal- Val Systems for Spaceborne Ocean Colour Sensors |
| 4.3 | Detection of Landslides from High Resolution Optical Satallite Data |
| 4.4 | MiniSAR: X band Airborne SAR |
| 4.5 | Photosynthesis Irradiance Incubator |
| 5 | Process |
| 5.1 | Anodising on Titanium Alloys |
| 5.2 | Black Anodizing On Aluminium 6061T6 & Chromating Technology |
| 5.3 | Ceramic foam (HTFOAM-1500) by Direct Foaming Technique |
| 5.4 | Corrosion Resistant Coating NRCM-204 |
| 5.5 | Cr-Cu-Au metallisation for Hi-Rel MIC fabrication |
| 5.6 | Chemical formulation of stable, low build electroless copper concentrate for PTH interconnections |
| 5.7 | Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Process for Printed Circuit Boards |
| 5.8 | Flameproofing Coating-Caspol |
| 5.9 | Gold Plating on Aluminium 6061 T6 and Kovar |
| 5.10 | Methods and system to control the data processing workflows in distributed environment with asynchro |
| 5.11 | Nano-Structured Metal Deposition by Electroplating Method for PCB required for Space Application |
| 5.12 | Nanoparticle (Silver & Gold) Coating on Aluminium |
| 5.13 | Power Conditioning and Processing Unit |
| 5.14 | Pulse Hard Anodising |
| 5.15 | Pulse Hard Anodization Process |
| 5.16 | Smart Fire-Retardant Coating |
| 5.17 | Silicone Polymer Based Thermal Protection system: PC-10 TPS |
| 5.18 | Silver Plated Waveguides Technology |
| 5.19 | Thermal Control Coating Technology |
| 5.20 | High Emissive silicon coating HESC/CSNM-29 |
| 6 | Mechanical and Pneumatics |
| 6.1 | D-Type Connector De-Mating Tool |
| 6.2 | Fabrication of Waveguide Runs |
| 6.3 | Precision Tapping Attachment |
| 6.4 | Piezo Electric Vibration Sensor |
| 6.5 | Tool For Connector Pin & Teflon Trimming |
| 6.6 | Umbilical Pads |
| 6.7 | Vibration Management Solutions |
| 6.8 | Sit on Umbilicals for Remote Fluid Servicing of Launch |
| 7 | Optics |
| 7.1 | Active 3D Imaging Lidar Camera |
| 7.2 | Miniaturized Methane Sensor based on GRIN Lens |
| 7.3 | Optical Imaging System |
| 8 | Material & Chemicals |
| 8.1 | Adbond EPP- 3521 |
| 8.2 | BMT Ceramics |
| 8.3 | Benzoxazine Polymer |
| 8.4 | Compensated Alumina (ComAl) for Electronic Applications |
| 8.5 | Coating Compound EPY 1061 |
| 8.6 | Cryo Adhesive EPIFIL-9661 |
| 8.7 | Ceramic Foam (HTFOAM-1500) by Direct Foaming Technique |
| 8.8 | DK 65 |
| 8.9 | DK-18 Ceramics |
| 8.10 | DK65 Ceramic for Microwave Applications |
| 8.11 | Film Adhesives EFA 1753 and EFA-1752 |
| 8.12 | EPG 2601[M] |
| 8.13 | FB-CVI for realisation of C-C Composite |
| 8.14 | Guanidinium Azotetrazolate (GZT) |
| 8.15 | High Density Sintered Silicon Carbie |
| 8.16 | High Emissive Silicone Coating, HESC/ CSNM-29 |
| 8.17 | High-Permittivity Ceramic (DK36) for R F Applications |
| 8.18 | HLP-85 Temperature Sensor |
| 8.19 | Hot pressed BN/ Sintered parts |
| 8.20 | Hot pressed/Silica Composites |
| 8.21 | Low Modulus Flex Seal Rubber Compound |
| 8.22 | Lithium Ion Cells |
| 8.23 | Low Density EPDM Based Thermal Insulation |
| 8.24 | Low Modulus Flex Seal Compound |
| 8.25 | Matrix resin for composite application EPY PEEKTOH |
| 8.26 | Mineral Algorithm |
| 8.27 | NITI Based Shape Memory Alloy |
| 8.28 | Nitinol Based Shape Memory Alloys |
| 8.29 | Phenolic Matrix Resin (PF-108) |
| 8.30 | Phenolic Resin (PF-106) |
| 8.31 | Polydimethylsilane (PDMS) |
| 8.32 | Paraffin Actuator Based HDRM |
| 8.33 | Rocasin |
| 8.34 | RTV Silicone Single Part Adhesive, Silcem R9 |
| 8.35 | SiC Foam Tile SICTILE-1650 by Replica Technique |
| 8.36 | Silica Aerogel Based Composite Sheet |
| 8.37 | Silica Aerogel By Ambient Pressure Drying Method |
| 8.38 | Silica Fibres |
| 8.39 | Silica Granules |
| 8.40 | Silicone Polymer Based Low Density Syntactic Foam TPS, SSF P-70 |
| 8.41 | Strontium Perchlorate |
| 8.42 | SCA-911 |
| 8.43 | Sealant EPY 2121N |
| 8.44 | Silicone Polymer based Thermal Protection System: PC- 10 TPS (Red) and (White) |
| 8.45 | Supercapattery |
| 8.46 | Waterproofing Compound RWPC-03 |
| 8.47 | 5- Aminoterazole Nitrate |
| 9 | Satellite / Sub-systems |
| 9.1 | Ceramic Servo Accelerometer |
| 9.2 | CFRB Honeycomb Core |
| 9.3 | Foil Heaters using Pyralux Adhesive |
| 9.4 | Heat pipe Honeycomb sandwich panel /special tooling process |
| 9.5 | ISRO Laser Gyro (ILG-300) |
| 9.6 | Indian Mini Satellite-1 (IMS-1) Bus |
| 9.7 | ISRO-DEEP Learning (DL) Satellite Data Synthesis |
| 9.8 | Integrated Tracking System for Satellite Auto Track |
| 9.9 | Monolithic composite cylindrical sandwich cells process |
| 9.10 | RF Rotary Joint |
| 9.11 | Special purpose picture for assembly and integration of space craft |
| 9.12 | Satellite Gateway Unit (SGU) |
| 10 | Software |
| 10.1 | E-smart Software |
| 10.2 | I-SCADA (no documents) |
| 10.3 | Model Source Codes for sugarcane Crop identification (no documents) |
| 10.4 | SAC Video Imaging System (SVIS) |